Interdiffusion kinetics between Cu and Ni polycrystalline films have been studied in the temperature range 200 - 300°C, in order to understand degradation paths for spin valve sensors at device processing temperatures. Fast grain boundary diffusion is found to cause extensive change for films of device dimensions.
By: T. H. Westmore, J. E. E. Baglin, V. R. Deline, A. J. Kellock, R. B. Beyers, E. L. Allen, M. A. Parker
Published in: RJ10124 in 1998
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