A Multiconductor Transmission Line Methodology for Global On-Chip Interconnect Modeling and Analysis

This paper describes a methodology for global interconnect
modeling and analysis using frequency-dependent multiconductor
transmission lines. The methodology allows designers to contain the
complexity of impedance computation by transforming the generic
inductance and resistance extraction problem into one of
per-unit-length parameter extraction. This methodology has been
embodied in a CAD tool that is now in production use by interconnect
designers and CMOS process technologists.