Three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structure with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagation to lifetime projections.
By: Baozhen Li; Emmanuel Yashchin; Cathryn Christiansen; Jason Gill; Ronald Filippi; Timothy Sullivan
Published in: RC23680 in 2005
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