Application of Three-Parameter Lognormal Distribution in EM Data Analysis

Three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structure with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagation to lifetime projections.

By: Baozhen Li; Emmanuel Yashchin; Cathryn Christiansen; Jason Gill; Ronald Filippi; Timothy Sullivan

Published in: RC23680 in 2005


This Research Report is available. This report has been submitted for publication outside of IBM and will probably be copyrighted if accepted for publication. It has been issued as a Research Report for early dissemination of its contents. In view of the transfer of copyright to the outside publisher, its distribution outside of IBM prior to publication should be limited to peer communications and specific requests. After outside publication, requests should be filled only by reprints or legally obtained copies of the article (e.g., payment of royalties). I have read and understand this notice and am a member of the scientific community outside or inside of IBM seeking a single copy only.


Questions about this service can be mailed to .