Materials Issues in Copper Interconnections

        No Abstract Available.

By: J. M. E. Harper, E. G. Colgan, C. K. Hu, J. P. Hummel, L. P. Buchwalter, C. E. Uzoh

Published in: Materials Research Bulletin, volume 19, (no 8), pages 23-29 in 1994

Please obtain a copy of this paper from your local library. IBM cannot distribute this paper externally.

Questions about this service can be mailed to reports@us.ibm.com .