Electrodeposition of Gold on Silicon

Gold electrodeposition on n-Si (100) surface was investigated by performing a detailed study on nucleation and growth. With addition of thallium in the solution, enhancement and inhibition of the gold deposition were observed at low potential and high potential, respectively. The nucleation of gold on Si was found to depend on the Au concentration and applied potential as well as the Tl+ addition. At low current densities Tl+ increases the Au nuclei size and decreases the density by catalyzing the nuclei growth. At high current densities, an opposite effect was observed. An adsorbed thallium intermediate species is proposed to explain both the catalytic and suppressive effects.

By: Q. Huang; H. Deligianni; L. T. Romankiw

Published in: RC23818 in 2005


This Research Report is available. This report has been submitted for publication outside of IBM and will probably be copyrighted if accepted for publication. It has been issued as a Research Report for early dissemination of its contents. In view of the transfer of copyright to the outside publisher, its distribution outside of IBM prior to publication should be limited to peer communications and specific requests. After outside publication, requests should be filled only by reprints or legally obtained copies of the article (e.g., payment of royalties). I have read and understand this notice and am a member of the scientific community outside or inside of IBM seeking a single copy only.


Questions about this service can be mailed to reports@us.ibm.com .