A Novel Nondestructive Picosecond Ultrasonics Technique to Evaluate Bonding Imperfections In Bonded Silicon-On-Insulator Structures

By: H.-Y. Hao, H. J. Maris, D. K. Sadana

Published in: RC21003 in 1997

This Research Report is not available electronically. Please request a copy from the contact listed below. IBM employees should contact ITIRC for a copy.

Questions about this service can be mailed to reports@us.ibm.com .