Wire Variation and Dummy Fill Impacts on RC and Delay

As device sizes continue to shrink, the design is increasingly affected by the variability in the back end of the line. We did a series of experiments to investigate the wire thickness/width variation impacts on RC and delay. The test results reveal that wire thickness and width variations have large impacts on RC and delay. Therefore, it is very important to understand and capture these kinds of variation impacts so as to improve product reliability and yield. In addition, we measure the dummy fill impacts on wire capacitance, and the test data show that the introduced capacitance can be up to 11.5%.

By: Hua Xiang; Ibrahim M. Elfadel; Ruchir Puri

Published in: RC23843 in 2006

LIMITED DISTRIBUTION NOTICE:

This Research Report is available. This report has been submitted for publication outside of IBM and will probably be copyrighted if accepted for publication. It has been issued as a Research Report for early dissemination of its contents. In view of the transfer of copyright to the outside publisher, its distribution outside of IBM prior to publication should be limited to peer communications and specific requests. After outside publication, requests should be filled only by reprints or legally obtained copies of the article (e.g., payment of royalties). I have read and understand this notice and am a member of the scientific community outside or inside of IBM seeking a single copy only.

rc23843.pdf

Questions about this service can be mailed to reports@us.ibm.com .