Development of Conductive Adhesive Materials for Via fill Applications

By: S. K. Kang, S. Buchwalter, N. Labianca, J. Gelorme, S. Purushothaman, K. Papathomas (IBM Microelectronics), M. Poliks (IBM Microelectronics)

Published in: 50th Electronic Components and Technology Conference - 2000 Proceedings. , New York, IEEE, p.887-91 in 2000

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