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An extensive study of crosstalk simulation issues for on-chip interconnections was performed for representative six-layer Al(Cu) structures. Guidelines are given for the range of conditions when R(f)L(f)C vs RLC vs RC circuit representations are valid. Examples are also given of realistic short and long coupled section interactions and the effect of in-plane neighboring connections is discussed. A frequency-dependent crosstalk simulation technique is shown. All simulation results are verified through measurement of a comprehensive set of experiments built with a large range of line widths and spaces on various layers with both in-plane and vertical coupling. Signal propagation and crosstalk are analyzed over the temperature range -160°C to +100°C and interconnect bandwidth limitations predictions are given.
By: A. Deutsch, C. W. Surovic, G. V. Kopcsay, P. W. Coteus, G. A. Sai-Halasz, P. J. Restle H. Smith, D. A. Webber, G. A. Katopis, W. D. Becker, A. H. Dansky
Published in: IEEE Transactions on Advanced Packaging, volume 22, (no 3), pages 292-308 in 1999
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