Thin Film Interactions Between Ti, TiN and Al During High Temperature Al Reflow For 1 Gb DRAM Interconnects

By: L. M. Gignac, K. P. Rodbell, L. A. Clevenger, R. C. Iggulden, R. F. Schnabel, S. J. Weber, C. lavoie, C. Cabral, Jr, P. W. DeHaven, Y. Y. Wang, S. H. Boettcher

Published in: RC21047 in 1997

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