Processing and Characterization of RTCVD Silicon Nitride and Oxynitride Grown in a Single Wafer Cluster Tool

By: C. P. D'Emie, E. P. Gusev, J. Newbury, P. Kozlowski, K. Chan, T. Zabel, P. Varekamp

Published in: RC21742 in 2000

This Research Report is not available electronically. Please request a copy from the contact listed below. IBM employees should contact ITIRC for a copy.

Questions about this service can be mailed to reports@us.ibm.com .