Study of Interfacial Reactions between Tin and Copper by Differential Scanning Calorimetry

Copyright [©] (1998) by IEEE. Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distrubuted for profit. To copy otherwise, to republish, to post on servers, or to redistribute to lists, requires prior specific permission and/or a fee.

By: S. K. Kang, S. Purushothaman

Published in: Journal of Electronic Materials, volume 27, (no 11), pages in 1998

Please obtain a copy of this paper from your local library. IBM cannot distribute this paper externally.

Questions about this service can be mailed to reports@us.ibm.com .