Silicon oxide, polymers, and epoxy composites are employed as dielectric layers in semiconductor devices. Adhesion of a dielectric layer to another dielectric layer or metal is important to the reliability of electronic packages such as back-end-of-line of a copper chip, a plastic flip chip package, a laminate chip carrier, and a multichip module (MCM) thin film package. Adhesion promoter is often employed to enhance the interface fracture toughness between organic dielectric and inorganic or metallic substrate. A new analytical method has been discovered for silane adhesion promoters by employing X-ray photoelectron spectroscopy (XPS) and reflectance absorbance FTIR. The first monolayer on a conductor surface can be distinguished from the second and upper layers by the charging effect of XPS. Adhesion promoters can also be used as a Cu-capping layer in MCM thin film packages. 8-Azaadenine acted as an adhesion promoter between polyimide and Cu probably because the N-H group reacted with Cu and the NH2 group reacted with polyimide to form covalent bonds.
By: Kang-Wook Lee
Published in: RC22461 in 2002
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