The present document summarizes the electrical characterization of the pixels developed for the TeraTOP project in Phase 2 according to the WP3 approach “THz Sensor 2/EM Coupled MEMS THz antenna”. The design of the Phase 2 sensor chip is based on the experience gained with the Phase 1 design and through some additional wafer runs submitted by IBM.
By: Dan Corcos, Danny Elad, Thomas Morf, Lukas Kull
Published in: H-0321 in 2015
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