Development of Lead (Pb)-Free Interconnection Materials for Microelectronics

Although the amount of Pb or Pb-containing solders used in microelectronics counts only a fraction of the total Pb usage, the demand for manufacturing "green" products has promoted active research and development for the Pb-free interconnection materials in the recent years. As a result, several candidate materials are now available in two categories: Pb-free solders and electrically conducting adhesives. In this paper, the new development activities of both materials are briefly reviewed in terms of their promising properties, applications and concerns.