MEMS Fabrications for Wireless Communications Using Copper Interconnect Technology

Wireless communications technology is growing and becoming a key segment of the semiconductor industry. One potential technology advancement is the miniaturization and integration of the passive components that currently make up 70% of the components in a cell phone and contribute to 80% of their costs [1]. Some of these passive components include inductors, variable capacitors, resonators, filters and switches. Integrating some or all of these passives on a single chip promises to introduce new designs of the wireless transceiver with added functionality so that multiple bands, multiple protocols, and internet connection can be handled by a single wireless device. Additional perceived benefits of integration on a single chip are increased performance, lower power consumption, and lower cost. This paper reviews the application of electrochemical processing to the fabrication of miniaturized integrated passive and MEMS devices.

By: Hariklia Deligianni; John M. Cotte; Christopher V. Jahnes; Paivikki Buchwalter; Nils Hoivik; Mahadevaiyer Krishnan; James Tornello; John H. Magerlein; David E. Seeger

Published in: RC23547 in 2005


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