Modeling and Effects of Manufacturing Variations On High-Speed Microprocessor Interconnect Performance

        This paper contributes the first study of manufacturing variation on interconnect timing performance in a high speed microprocessor. Also new in this paper is a methodology using timing analysis in conjunction with post-extraction net adjustment to account for interconnect structure variation (e.g. that arising due to pattern dependencies); this methodology is efficient enough to enable thousands of nets to be analyzed for variation without the need to modify current CAD tools.

By: Vikas Mehrotra, Sani Nassif, Duane Boning, James Chung

Published in: RC21302 in 1998

This Research Report is not available electronically. Please request a copy from the contact listed below. IBM employees should contact ITIRC for a copy.

Questions about this service can be mailed to reports@us.ibm.com .