Broadband Characterization of Representative Circuit-to-Circuit Interconnections

        This paper reviews the major class of chip-to-chip interconnections used in high-performance computers and communication systems. The critical electrical characteristics are highlighted and the most beneficial type of measurement techniques are exemplified for cables, printed-circuit=boards, ceramic, thin-film, and on-chip wiring.

By: Alina Deutsch

Published in: RC20517 in 1996

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